AeroZero® Laminate Product Platforms
Silicone Adhesive
- Lightweight (85% Air)
- Very Thin with Small Footprint
- Low Thermal Conductivity
- Good Mechanical Properties for Low Density Material
- Easy Bonding Due to High Surface Area/Energy
Aerospace & Defense, Electronics
Metal or Graphite
- Extremely High 1000 °C Thermal Capability
- Increased Efficiency Due to Weight Reduction
- Excellent Thermal Management
- High Performance Hot Spot Reduction
Aerospace & Defense
Copper
- Ultra Low Dk/Df
- High Tg Greater than (300 °C)
- High Heat Resistance (550 °C @ 10% wt)
- Ease in Incorporating in Multi-layer Stacks
- For Flex and Rigid Substrates
Information Communication Technology (ICT)
Polyimide Film
- Ultra Low Dk/Df
- Enables Small Footprint/Tight Designs
- Lightweight
- High Thermal Stability
- Ability for AeroZero® to Conform 2- Dimensionally
Aerospace & Electonic Communication
Silicone Adhesive
- Lightweight (85% Air)
- Very Thin with Small Footprint
- Low Thermal Conductivity
- Good Mechanical Properties for Low Density Material
- Easy Bonding Due to High Surface Area/Energy
Aerospace & Defense, Electronics
Metal or Graphite
- Extremely High 1000 °C Thermal Capability
- Increased Efficiency Due to Weight Reduction
- Excellent Thermal Management
- High Performance Hot Spot Reduction
Aerospace & Defense
Copper
- Ultra Low Dk/Df
- High Tg Greater than (300 °C)
- High Heat Resistance (550 °C @ 10% wt)
- Ease in Incorporating in Multi-layer Stacks
- For Flex and Rigid Substrates
Information Communication Technology (ICT)
Polyimide Film
- Ultra Low Dk/Df
- Enables Small Footprint/Tight Designs
- Lightweight
- High Thermal Stability
- Ability for AeroZero® to Conform 2- Dimensionally
Aerospace & Electonic Communication
Laminate Constructions
Thermal Management Laminates
Thermal Management Laminates (Ultra High Temp.)
Cu Clad Flex & Multi-layer Circuit Boards
Radome & Antenna Substrates
Specifications
| Product Platform AeroZero® (AZ) | Single or Double Sided | Substrate | Adhesive | Substrate Thickness | Adhesive Thickness | Total Laminate Thickness |
|---|---|---|---|---|---|---|
|
Product Platform AeroZero® (AZ)
AZ + Silicone PSA
|
Single or Double Sided
Single
|
Substrate
None
|
Adhesive
Silicone PSA
|
Substrate Thickness
N/A
|
Adhesive Thickness
1 Mil
25 Micron |
Total Laminate Thickness
6 Mil
Micron 150 |
|
Product Platform AeroZero® (AZ)
AZ + Metal
|
Single or Double Sided
Single
|
Substrate
Aluminum Foil
|
Adhesive
Silicone PSA
|
Substrate Thickness
2 Mil
50 Micron |
Adhesive Thickness
1 Mil
25 Micron |
Total Laminate Thickness
6 Mil
200 Micron |
|
Product Platform AeroZero® (AZ)
AZ + Graphite
|
Single or Double Sided
Single
|
Substrate
Graphite
|
Adhesive
Silicone PSA
|
Substrate Thickness
2 Mil
5 Micron |
Adhesive Thickness
1 Mil
25 Micron |
Total Laminate Thickness
8 Mil
200 Micron |
|
Product Platform AeroZero® (AZ)
AZ + Copper
|
Single or Double Sided
Double
|
Substrate
Copper
|
Adhesive
Proprietary
|
Substrate Thickness
0.7 Mil
18 Micron |
Adhesive Thickness
1 Mil
25 Micron |
Total Laminate Thickness
8.4 Mil
210 Micron |
|
Product Platform AeroZero® (AZ)
AZ + Polyimide
|
Single or Double Sided
Single or Double
|
Substrate
Polyimide
|
Adhesive
FEP
|
Substrate Thickness
1 Mil
25 Micron |
Adhesive Thickness
1 Mil
25 Micron |
Total Laminate Thickness
7 Mil
180 Micron 9 Mil 230 Micron |
Copper Clad standard size: 6 in. x 9 in. (15 cm x 23 cm)
Benefits of AeroZero® as an Ingredient in Composite Materials
Lightweight
AeroZero’s® unique material properties empower innovative composite material designs. With a density of 0.30 g/cm3, nearly 5 times lower than the density of normal polyimides (1.4 g/cm3), AeroZero® will offer structural integrity while decreasing total weight.
RF Transparency
AeroZero® film’s dielectric constant is 1.45 with a very low loss tangent of 0.004 over 1 – 10 GHz, which is just 0.45 higher than air itself. As a material with superior thermally insulative capabilities, our polymer aerogel offers revolutionary properties for the radome, radar, and electronics industries.
Machinability
With a machinability index comparable to balsa wood, and no toxic dusting when cut, AeroZero® is an easy material to work with and integrate into existing manufacturing processes.
Insulating
AeroZero’s® low thermal conductivity makes it an ideal material to use in composite structures subject to a wide temperature envelope. With an expected thermal conductivity of just 30mW/KM, the nanoscale voids that make up AeroZero® significantly slow heat to transfer through the substance.
Durable
AeroZero® possesses impressive mechanical strength relative to its density. When used in multilayer structures, AeroZero® provides outstanding mechanical durability in a wide operating temperature envelope.
