Standard Size
- Letter sized (8.5″ x 11″) sheets
- Longer rolls available upon request
Standard Substrates
- Metallic Substrates (Stainless Steel, Aluminum, Copper)
- Non-metallic Substrates (Graphite)
- Polymeric Substrates (Kapton, Polyimides)
AeroZero® Laminate Platform
AeroZero® film itself is a durable and insulative polyimide aerogel. Where our customers find the most benefit is by incorporating AeroZero into composite and laminate structures. We have developed our AeroZero Standard Laminates that can be seen in the figure below.
Our laminates are created by combining AeroZero film with a high-temperature adhesive, and at least one other substrate such as metals, polyimides, or other materials that meet our customers needs. We are able to manufacture laminates designed specifically to withstand our customers extreme application requirements, and exceed expectations.
Due to the wide range of laminate configurations available, we are able to provide specialized solutions based on the problems our customers encounter. The unique combination of low thermal conductivity and diffusivity, high heat tolerance, ultra-low dielectric properties, high strength-to-density ratio – all in a very thin profile, combine to make AeroZero laminates a preferred option in demanding industries around the world
See What AeroZero® Can Do For You!
We work closely with our customers to create customized solutions to tackle application challenges. Learn more about how AeroZero® enables innovative designs and contact Blueshift today.
Silicone Adhesive
- Lightweight (85% Air)
- Very Thin with Small Footprint
- Low Thermal Conductivity
- Good Mechanical Properties for Low Density Material
- Easy Bonding Due to High Surface Area/Energy
Aerospace & Defense, Electronics
Metal or Graphite
- Extremely High 1000 °C Thermal Capability
- Increased Efficiency Due to Weight Reduction
- Excellent Thermal Management
- High Performance Hot Spot Reduction
Aerospace & Defense
Copper
- Ultra Low Dk/Df
- High Tg Greater than (300 °C)
- High Heat Resistance (550 °C @ 10% wt)
- Ease in Incorporating in Multi-layer Stacks
- For Flex and Rigid Substrates
Information Communication Technology (ICT)
Polyimide Film
- Ultra Low Dk/Df
- Enables Small Footprint/Tight Designs
- Lightweight
- High Thermal Stability
- Ability for AeroZero® to Conform 2- Dimensionally
Aerospace & Electonic Communication
Silicone Adhesive
- Lightweight (85% Air)
- Very Thin with Small Footprint
- Low Thermal Conductivity
- Good Mechanical Properties for Low Density Material
- Easy Bonding Due to High Surface Area/Energy
Aerospace & Defense, Electronics
Metal or Graphite
- Extremely High 1000 °C Thermal Capability
- Increased Efficiency Due to Weight Reduction
- Excellent Thermal Management
- High Performance Hot Spot Reduction
Aerospace & Defense
Copper
- Ultra Low Dk/Df
- High Tg Greater than (300 °C)
- High Heat Resistance (550 °C @ 10% wt)
- Ease in Incorporating in Multi-layer Stacks
- For Flex and Rigid Substrates
Information Communication Technology (ICT)
Polyimide Film
- Ultra Low Dk/Df
- Enables Small Footprint/Tight Designs
- Lightweight
- High Thermal Stability
- Ability for AeroZero® to Conform 2- Dimensionally
Aerospace & Electonic Communication
Laminate Constructions
Thermal Management Laminates
Single-Sided
Double-Sided
Thermal Management Laminates (Ultra High Temp.)
Single-Sided
Double-Sided
Cu Clad Flex & Multi-layer Circuit Boards
Single-Sided
Double-Sided
Radome & Antenna Substrates
Single-Sided
Double-Sided
Specifications
| Product Platform AeroZero® (AZ) | Single or Double Sided | Substrate | Adhesive | Substrate Thickness | Adhesive Thickness | Total Laminate Thickness |
|---|---|---|---|---|---|---|
|
Product Platform AeroZero® (AZ)
AZ + Silicone PSA
|
Single or Double Sided
Single
|
Substrate
None
|
Adhesive
Silicone PSA
|
Substrate Thickness
N/A
|
Adhesive Thickness
1 Mil
25 µm |
Total Laminate Thickness
7.5 Mil
190 µm |
|
Product Platform AeroZero® (AZ)
AZ + Silicone PSA + AZ
|
Single or Double Sided
Double
|
Substrate
None
|
Adhesive
Silicone PSA
|
Substrate Thickness
N/A
|
Adhesive Thickness
1 Mil
25 µm |
Total Laminate Thickness
15 Mil
380 µm |
|
Product Platform AeroZero® (AZ)
AZ + Metal
|
Single or Double Sided
Single
|
Substrate
Aluminum
|
Adhesive
Silicone PSA
|
Substrate Thickness
2 Mil
50 µm |
Adhesive Thickness
1 Mil
25 µm |
Total Laminate Thickness
9.5 Mil
240 µm |
|
Product Platform AeroZero® (AZ)
AZ + Graphite
|
Single or Double Sided
Single
|
Substrate
Graphite
|
Adhesive
Silicone PSA
|
Substrate Thickness
2 Mil
50 µm |
Adhesive Thickness
1 Mil
25 µm |
Total Laminate Thickness
9.5 Mil
240 µm |
|
Product Platform AeroZero® (AZ)
AZ + Copper
|
Single or Double Sided
Double
|
Substrate
Copper
|
Adhesive
Proprietary
|
Substrate Thickness
0.7 Mil
18 µm |
Adhesive Thickness
1 Mil
25 µm |
Total Laminate Thickness
9.9 Mil
250 µm |
|
Product Platform AeroZero® (AZ)
AZ + Polyimide
|
Single or Double Sided
Single
|
Substrate
Polyimide
|
Adhesive
FEP
|
Substrate Thickness
1 Mil
25 µm |
Adhesive Thickness
1 Mil
25 µm |
Total Laminate Thickness
8.5 Mil
220 µm |
|
Product Platform AeroZero® (AZ)
AZ + Polyimide
|
Single or Double Sided
Double
|
Substrate
Polyimide
|
Adhesive
FEP
|
Substrate Thickness
1 Mil
25 µm |
Adhesive Thickness
1 Mil
25 µm |
Total Laminate Thickness
10.5 Mil
270 µm |
Benefits of AeroZero® as an Ingredient in Composite Materials
Machinability
With a machinability index comparable to balsa wood, and no toxic dusting when cut, AeroZero® is an easy material to work with and integrate into existing manufacturing processes.
Lightweight
AeroZero’s® unique material properties empower innovative composite material designs. With a density of 0.30 g/cm3, nearly 5 times lower than the density of normal polyimides (1.4 g/cm3), AeroZero® will offer structural integrity while decreasing total weight.
RF Transparency
AeroZero® film’s dielectric constant is 1.45 with a very low loss tangent of 0.004 over 1 – 10 GHz, which is just 0.45 higher than air itself. As a material with superior thermally insulative capabilities, our polymer aerogel offers revolutionary properties for the radome, radar, and electronics industries.
Insulating
AeroZero’s® low thermal conductivity makes it an ideal material to use in composite structures subject to a wide temperature envelope. With an expected thermal conductivity of just 30mW/KM, the nanoscale voids that make up AeroZero significantly slow heat to transfer through the substance.
Durable
AeroZero® possesses impressive mechanical strength relative to its density. When used in multilayer structures, AeroZero provides outstanding mechanical durability in a wide operating temperature envelope.
